CEM-3復合基覆銅板
福建利豪電子科技股份有限公司
FUJIAN LIHAO ELECTRONIC TECHNOLOGY CO., LTD.
福建省南安市霞美鎮
TEL:0595-86785298 FAX：0595-86785296
CEM-3 TDS
CEM-3單面板 Single Sided
CEM-3 是復合基（玻纖紙、玻纖布）覆銅箔層壓板，具有良好的耐濕、耐熱性及尺寸穩定性，并且適用于低溫沖孔加工作業。
CEM-3 is a composite substrate (fiberglass paper, fiberglass cloth) copper clad laminate with excellent performance in flame resistance and dimensional stability.It has good heat and humidity resistance and is suitable for cold punching.
級別組成Grade and Construction
型號Type | 級別Grade | 組成Construction |
CEM-3 | CPFCP(G)-41F | 酚醛樹脂、環氧樹脂、玻纖布、玻纖紙、銅箔 Phenolic resin,epoxy resin,fiberglass cloth, fiberglass paper,copper foil |
特點 Feature
·通用型
Low cost but with wide range of application
·彎曲度、扭曲度小且穩定
Warpage and twist are small and stable
·優異的耐濕熱性
Excellent heat and humidity resistance
·尺寸穩定性優越
Excellent dimensional stability
標準數據 Standard configuration
厚度 Thickness ：0.8mm-1.6mm
常規尺寸 Regular Size(mm) ：1041*1245
其它尺寸 Other Size ：As specified by customers
一般性能 General Properties
序號 NO. | 檢測項目 Item | 單位 Unit | 檢測條件 Test Condition | 標準值 Standard Value | 典型值 Typical Value |
| 1 | 耐焊性（260℃） Solder resistance | 秒/Sec | A | ≥10 | 18 |
| 2 | 剝離強度（25μm銅箔） Peel Strength (Copper Foil 25μm) | N/mm | A | ≥1.2 | 1.4-1.6 |
| 3 | 彎曲強度 Fleural Strength | MPa | 縱向Lengthwise | ≥276 | 312 |
| 橫向 Crosswise | ≥186 | 138 | |||
| 4 | 吸水率 Water Absorption | % | E-24+D-24/23 | ≤0.5 | 0.43 |
| 5 | 表面電阻 Surface Resistance | MΩ | C-96/35/90 | ≥1.0*104 | 3.5*104 |
| 6 | 體積電阻 Volume Resistivity | MΩ.cm | C-96/35/90 | ≥1.0*106 | 6.3*106 |
| 7 | 介電常數（1MHz） Dielectric Constant | - | C-96/40/90 | ≤5.4 | 4.4 |
| 8 | 介電損耗因素（1MHz） Dissipation Factor | C-96/40/90 | ≤0.035 | 0.032 | |
| 9 | 沖孔溫度 Punching Temperature | ℃ | 室溫-90 Ambient -90 | 50-90 |
注 Remark:1. 試驗方法參照GB/T 4724-2017
The test methods are according to GB/T 4722-2017
2. 包裝、標志、運輸和儲存按照GB/T 4721 中的規定；
Packing, marking, transportation and storage shall be in accordance with GB/T 4721
3. 樣品厚度：1.6mm，典型值只作參考
Specimen Thickness:1.6mm, Typical values for reference only